This is an old revision of this page, as edited by 24.18.40.174 (talk) at 02:52, 25 September 2009 (minor edit to 'Tg' to put the 'g' in subscript.). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.
Revision as of 02:52, 25 September 2009 by 24.18.40.174 (talk) (minor edit to 'Tg' to put the 'g' in subscript.)(diff) ← Previous revision | Latest revision (diff) | Newer revision → (diff)In electronics, potting is a process of filling a complete electronic assembly with a solid compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermosetting plastics are often used.
Most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair.
When potting a circuit board that uses surface-mount technology, it is recommended to use low Tg potting compounds such as polyurethane or silicone, because high Tg potting compounds may break solder bonds as they harden and shrink at low temperatures.
See also
External links
This electronics-related article is a stub. You can help Misplaced Pages by expanding it. |